Titanium Silicide is Ti5Si3. It has exceptional characteristics. It has an excellent melting point of 2 403 K, low density (4.32g/cm3). Low resistivity (50 –120mO*cm), hardness (968HV), as well high temperature resistance.
Purity: 99%
Particle sizes: 5-10um
About Titanium Silicide, Ti5Si3 Puffer:
HTML5Si3 possesses good high temperature stability, high heat strength and excellent oxidation resistance. You can sinter Si or Ti powder by heating it up to 1350-1450. When the furnace cools to room temperature the material is added with anhydrous ethanol. This mixture is then poured into a sealed ball mill tank. AR gas is used as a protection gas.
15giorni is a trustworthy global Siliconium Silicide TIP5Si3 Powder supplier. Please feel free to contact us for information about the WTI5Si3 Powder.
Product Performance of Titanium Silicide Ti5Si3 Powder:
Titanium Silicide (“Ti5Si3)) has many excellent properties. It does not have a high melting temperature (2403K), but also has low density (4.39g/cm3), high resistivity (50–120cm), high toughness (968HV) and excellent resistance to high temperature oxygenation.
Technical Parameter Of Titanium Silicide Ti5Si3 powder:
– Particle Size
Titanium silica powder Ti5Si3:
How Titanium Silicide Powder Ti5Si3 Created?
Ti5Si3 usually can be prepared through a casting process, powder, sintering and rapid solidification. These techniques are susceptible to contamination, high yield, limited, or complex technology.
1. The invention refers to a batch process for making trisilicate Pentatitanium intermetallic compounds powder. It is described by the steps below:
(1) Ti5Si3 compounds were synthesized through vacuum sintering. The process involved the weighting of Si powder, and Ti powder at a molar proportion of 3 to 5.
(2) Following the procedure in Step 1, sinter Si powder and Ti powder evenly together in a vacuum oven. Once the temperature reaches 1350-1450 degrees, turn the furnace on and let it cool to room-temperature.
(3) The anhydrous, sintered materials were mixed with the second step and added to ethanol. Finally, the ball mill tank was filled. A sealed ball-mill tank was placed inside a high energy planetary ballmill with AR gas protecting it. It was later refined through the wetball mill method.
You can vacuum dry the ball-milling slurry in step (3) and grind it. The Ti5Si3 powder is obtained by passing through an 130-mesh sieve.
2. In Claim 1, the batch preparation procedure of trisilicate-intermetallic compound powder was described. The characteristic of this step (2) is that it has a vacuum temperature of less than 10.010-2Pa.
3. According to claim 1, batch preparation methods for trisilicate intermetallic complex powder are described as follows.
4. 1. The characteristics of batch preparation for trisilicate intermetallic complex powder (referenced in claim 1) are: the rotational speed at which the planetary ballmill is used in step (3) of the claimed method is 300-500 RPM; the grinding time of the ball is 24-48hrs.
This procedure for batch preparation of Trisilicate Penta Titanium Intermetallic Complex Powder according to the molar relationship of 3:5 weight Si powder and Ti powder. This eliminates flaws such as self-spreading burning, quick solidification and powder pressing. Reactions are free of byproducts. They can ensure high purity and consistent distribution.
Titanium Silicide, Ti5Si3 powder
Titanium silicide (“Ti5Si3) has been widely employed in the fabrication of metal oxide semiconductors MOS and metal oxide-semic field-effect transistors MOSFET and dynamic random access memories (DRAM), gates, source/drain connections and ohmic Contacts.
Packing & Shipping Titanium Silicide T5Si3 powder:
There are many packing options available that depend on the quantity of titanium Si3 powder.
Packaging: vacuum Packing, 100g,500g or one kilogram per bag, Titanium Silicide Si5Si3 powder, or as you request.
Shipping Ti5Si3 titanium powder: can be shipped by sea, express or by air once payment is received.
Luoyang Tongrun 15giorni Technology Co. Ltd.
Contact us if you need high-quality titanium HTML3 chips . (brad@ihpa.net)
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